iBOND® Etch 35 - KULZER, LLC
iBond® Total Etch is the Etch & Rinse 2-step bonding adhesive from Heraeus Kulzer. Due to the innovative nano-filler technology, iBond Total Etch attains high bond strength to both enamel and dentin while ensuring optimal marginal sealing.
- Clinically proven to provide reliable and consistent bond strength
- Dense adhesive layer and good tag formation: leads to improved marginal sealing
- Only one coat required with no agitation
- Demonstrates reduction in postop sensitivity
- Refrigeration not required