Bond-1 – Primer/Adhesive 37% Etch Gel - Pentron
Bond-1 Primer/Adhesive is a 5th generation total-etch bonding system that provides high bond strengths in a convenient single bottle application. Bond-1 Primer/Adhesive has been proven to create the ideal sealed surface and interpenetrated network of the polymerized primers and unfilled resin, resulting in a high bond with a low film thickness of only 8 µm.
- Simple, time-saving and reliable bonding system
- High bond strength to both dentin and enamel
- Extremely versatile system – bond direct or indirect, light or chemical cured composites, porcelains, metal restorations and amalgam to tooth structure
- Low film thickness ensures the ideal surface to bond to restorative materials