Clearfil™ Universal Bond Quick Standard Kit - Kuraray America Inc

A single-dose, universal adhesive with a new patented MDP-Amide based chemistry that provides unique rapid bond technology. This new technology reduces technique sensitivity and application time without compromising bond strength.

  • Can be used for total-etch, self-etch and selective-etch techniques
  • Ideal for all procedures – direct, indirect, core buildup and repair
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